Webinar
High-efficiency PVT and Monte Carlo analysis in TSMC AMS Reference Flow for optimal yield in memory, analog and digital design

In a recent independent survey, variation-aware custom IC design was ranked the number one area requiring advancement over the next two years. The survey revealed:
- 53% of design groups missed deadlines or experienced respins due to variation issues
- Designers experienced an average 2 month delay due to variation issues
- Designers spent an average 22% of design time on variation issues
For further information, see the Gary Smith EDA analyst report on variation design.
Attendees of this webinar learned:
- Variation challenges in custom IC design
- Variation-aware solutions available in the TSMC AMS reference flow
- Methods to develop and verify designs over PVT corners in less time
- How to efficiently apply Monte Carlo techniques in design sign-off
- How Monte Carlo is really possible up to 6-sigma
- Customer case studies of the above methods
Solido customer case studies include:
- NVIDIA for memory, standard cell, analog/RF design
- Qualcomm for memory design
- Huawei-HiSilicon for analog design
- Qualcomm for I/O design
- Anonymous for analog/RF design
Presenters:
- Nigel Bleasdale, Director of Product Management, Solido Design Automation
- Jason Chen, Design Methodology and Service Marketing, TSMC
Audience: Circuit Designers, Design Managers, CAD Engineers

