Webinar

High-efficiency PVT and Monte Carlo analysis in TSMC AMS Reference Flow for optimal yield in memory, analog and digital design

In a recent independent survey, variation-aware custom IC design was ranked the number one area requiring advancement over the next two years. The survey revealed:

  1. 53% of design groups missed deadlines or experienced respins due to variation issues
  2. Designers experienced an average 2 month delay due to variation issues
  3. Designers spent an average 22% of design time on variation issues

For further information, see the Gary Smith EDA analyst report on variation design.

Attendees of this webinar learned:

  1. Variation challenges in custom IC design
  2. Variation-aware solutions available in the TSMC AMS reference flow
  3. Methods to develop and verify designs over PVT corners in less time
  4. How to efficiently apply Monte Carlo techniques in design sign-off
  5. How Monte Carlo is really possible up to 6-sigma
  6. Customer case studies of the above methods

Solido customer case studies include:

  1. NVIDIA for memory, standard cell, analog/RF design
  2. Qualcomm for memory design
  3. Huawei-HiSilicon for analog design
  4. Qualcomm for I/O design
  5. Anonymous for analog/RF design

Presenters:

  1. Nigel Bleasdale, Director of Product Management, Solido Design Automation
  2. Jason Chen, Design Methodology and Service Marketing, TSMC

Audience: Circuit Designers, Design Managers, CAD Engineers

Download presentation (pdf)

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